| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device, capable of providing better vibration performance by improving conductivity of electrodes on a piezoelectric vibration piece and/or those of the side of a package, and a conductive adhesive. <P>SOLUTION: The package 36 with the electrodes 31, 31 comprising a base layer and a gold or gold alloy layer, and the piezoelectric vibration piece 32 with mounted electrodes 52, 52 comprising the base layer and the gold or gold alloy layer to be jointed with the electrodes in the package are prepared. The manufactured method includes a jointing process ST3 for jointing the electrodes 31, 31 in the package with the piezoelectric vibration piece, and a sealing process ST5 for airtightly blocking the package 36, and is also provided with steps (ST2-1, ST2-2) for cleaning at least either the mount electrodes of the piezoelectric vibrating piece or the electrodes portions in the package. <P>COPYRIGHT: (C)2004,JPO |
