| 摘要 |
PURPOSE:To obtain a bonding device that can automatically supply a rack containing a workpiece to a loading device and can automatically set data about bonding by providing a rack supplying device with a reading device which read recording data of a recording means attached to an actual rack. CONSTITUTION:A rack feeding device 50 is disposed close to a loading device 45, at a position opposite thereto, and this rack feeding device 50 supplies an actual rack 20A and delivers a group of leadframes 1 contained in the actual rack 20a to the loading device 45 in a packaged manner. The rack feeding device 50 is provided with a reading device 60 which reads recording data of a recording means attached to the actual rack 20A. An unloading device 61 is disposed parallel to the rack feeding device 50, and receives a depleted rack 20B from which the group of leadframes 1 have been discharged by the rack feeding device 50. The unloading device causes the original leadframe 1 subjected to a bonding operation to be housed into that depleted rack 20 for each sheet of leadframes. |
