发明名称 |
APPARATUS FOR ELECTROSTATICALLY DEPOSITING AND RETAINING MATERIALS UPON A SUBSTRATE |
摘要 |
A substrate (104) having a planar conductive plating (106) located on a first surface of a dielectric layer (108) and having a conductive collection trace (110) on a second surface of the dielectric layer (108) such that the conductive plating (106) and collection trace (110) have a parallel, spaced apart relation. The collection trace (110) is charged by supplying a voltage to the plating (106) and the trace (110) to establish a voltage differential across the dielectric layer (108). The material to be deposited (116) is charged to a polarity opposite that of the trace (110) so that the deposited material (102) is electrostatically retained. |
申请公布号 |
WO9639256(A1) |
申请公布日期 |
1996.12.12 |
申请号 |
WO1996US09439 |
申请日期 |
1996.06.06 |
申请人 |
DAVID SARNOFF RESEARCH CENTER, INC. |
发明人 |
PLETCHER, TIMOTHY, ALLEN |
分类号 |
A61M11/00;A61M15/00;A61M15/02;B05B5/025;B05B5/08;B05B15/04;B41J2/415;G03G17/00 |
主分类号 |
A61M11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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