| 摘要 |
<p>Lamination of films of plastics to one another, and a film to a base plate of wood, metal and other composite material (in particular, lamination of a photoresist forming layer to a circuit board) is continuously performed by vacuum heating and pressurization without leaving bubbles between layers. A laminated, molded product (L) is obtained by defining a closed chamber by an upper plate (1) provided with a fixed film (3), a lower plate (2) provided with a movable film (4), and a frame body (6) provided between the upper and lower plates, continuously feeding a material (H) being molded into and receiving the same in the chamber, effecting suction to not higher than one atmospheric pressure through pipes (14, 25), effecting pressurization to 2 to 10 atmospheric pressure through the pipe (25) while continuing suction through the pipe (14), pressing the material against the fixed film (3) with the movable film (4) therebetween, and heating the material by means of heating means (12, 22) provided on the upper and lower plates.</p> |
