| 摘要 |
PROBLEM TO BE SOLVED: To reduce unevenness of thickness to improve flatness by bringing a hot plate heated substantially uniformly into contact with the back of a wafer polishing plate to substantially uniformly solidifying wax applied to the surface of the wafer-polishing plate. SOLUTION: A heat conductive member 3 is heated by a heating element 2, and the back of a wafer-polishing plate 20 is made closely adhere to the heated heat conductive member 3 to be heated indirectly. Thus, wax applied to the surface of the wafer polishing plate 1 is solidified substantially uniformly. Accordingly, the wafer polishing plate 1 to which wax is applied is heated uniformly so that a raw material wafer can be stuck flat to the wafer polishing plate 1 to reduce unevenness of thickness of the mirror finished surface wafer in the polishing process to heighten flatness. |
