发明名称 METHOD FOR REPAIRING CIRCUIT CONNECTON PART, AND STRUCTURE AND METHOD FOR CONNECTING CIRCUIT TERMINAL OF CIRCUIT REPAIRED BY THE METHOD
摘要 <p>A method for removing adhesive in a short time without requiring any solvent in order to shorten the repairing time. In the method for repairing a circuit connection part where circuit members having a large number of opposed circuits are connected electrically through an adhesive, mutual joints at a circuit connection part requiring repair are separated, a basic material for transfer is bonded through a transfer adhesive for transfer to at least one circuit member where the adhesive remains and then the adhesive remaining on the circuit member and the transfer adhesive are removed from the circuit member along with the basic material for transfer.</p>
申请公布号 WO0189277(A1) 申请公布日期 2001.11.22
申请号 WO2001JP04108 申请日期 2001.05.17
申请人 HITACHI CHEMICAL CO., LTD.;ARIFUKU, MOTOHIRO;YASUDA, HIROSHI;WATANABE, ITSUO;KOBAYASHI, KOUJI;TSUKAGOSHI, ISAO 发明人 ARIFUKU, MOTOHIRO;YASUDA, HIROSHI;WATANABE, ITSUO;KOBAYASHI, KOUJI;TSUKAGOSHI, ISAO
分类号 H05K3/22;H05K3/32;H05K3/36;(IPC1-7):H05K3/34;C09J9/02;H05K3/26;C09D9/00 主分类号 H05K3/22
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