| 摘要 |
<p>A surface mount light emitting device package (10) comprises: a surface mount lead frame (12) comprising a thermally and electrically conductive reflector cup (14) and leads (16 and 18); a light emitting device (20) situated within the reflector cup and coupled to the leads; and encapsulant (22) disposed around the light emitting device and around the reflector cup.</p> |
