发明名称 |
System for fabricating an integrated circuit package on a printed circuit board |
摘要 |
A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.
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申请公布号 |
US7306133(B2) |
申请公布日期 |
2007.12.11 |
申请号 |
US20040825810 |
申请日期 |
2004.04.16 |
申请人 |
ST ASSEMBLY TEST SERVICES LTD. |
发明人 |
JIN YONGGANG;YONG SHELLEY;CHUA PUAY GEK;SHIN WON SUN |
分类号 |
B23K31/02;B23K1/008;B23K1/20 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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