| 摘要 |
To simplify the burn-in process and reduce its cost for a surface-emitting type wafer and its manufacturing method, and for a burn-in method for a surface-emitting type wafer. A surface-emitting type wafer includes a substrate 10 and a plurality of surface-emitting type elements 1 formed above the substrate 10 . Each of the surface-emitting type elements 1 includes a light emitting element section 20 , first and second electrodes 30, 32 for driving the light emitting element section 20 , and a rectification element section 40 . The rectification element section 40 is connected in parallel between the first and second electrodes 30, 32 , and has a rectification action in a reverse direction with respect to the light emitting element section 20 . The plurality of surface-emitting type elements 1 are connected in series in a direction in which forward directions of the respective light emitting element sections 20 coincide with one another.
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