发明名称 |
COOLING DEVICE AND METHOD FOR MANUFACTURE THEREOF |
摘要 |
<p>The object is to provide a cooling device having a low thermal contact resistance between the cooling device and other material at a low cost. The cooling device is characterized by comprising a cooling body and a composite layer which is formed on at least one surface of the cooling body and which comprises a complex of a fine whisker-like structure and a metal, wherein one end of the fine whisker-like structure is exposed on the surface of the metal in the composite layer. The fine whisker-like structure is preferably a carbonaceous material such as a carbon nanotube, a carbon nanofiber or a carbon fiber.</p> |
申请公布号 |
WO2009075320(A1) |
申请公布日期 |
2009.06.18 |
申请号 |
WO2008JP72493 |
申请日期 |
2008.12.11 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;KAWAI, CHIHIRO |
发明人 |
KAWAI, CHIHIRO |
分类号 |
F28D15/02;C23C26/00;C25D5/00;C25D7/04;H01L23/36;H01L23/427 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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