发明名称 COOLING DEVICE AND METHOD FOR MANUFACTURE THEREOF
摘要 <p>The object is to provide a cooling device having a low thermal contact resistance between the cooling device and other material at a low cost. The cooling device is characterized by comprising a cooling body and a composite layer which is formed on at least one surface of the cooling body and which comprises a complex of a fine whisker-like structure and a metal, wherein one end of the fine whisker-like structure is exposed on the surface of the metal in the composite layer. The fine whisker-like structure is preferably a carbonaceous material such as a carbon nanotube, a carbon nanofiber or a carbon fiber.</p>
申请公布号 WO2009075320(A1) 申请公布日期 2009.06.18
申请号 WO2008JP72493 申请日期 2008.12.11
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;KAWAI, CHIHIRO 发明人 KAWAI, CHIHIRO
分类号 F28D15/02;C23C26/00;C25D5/00;C25D7/04;H01L23/36;H01L23/427 主分类号 F28D15/02
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