发明名称 |
Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same |
摘要 |
Parts of pad electrodes formed on an interconnection board so as to correspond to bump electrodes of a semiconductor pellet that neighbor parts superposed with the bump electrodes are caused to extend in substantially the same direction, and ultrasonic vibration is applied in this extension direction so as to make a connection between the pad electrodes and the bump electrodes.
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申请公布号 |
US6670706(B2) |
申请公布日期 |
2003.12.30 |
申请号 |
US20000536148 |
申请日期 |
2000.03.28 |
申请人 |
NEC CORPORATION |
发明人 |
IKEGAMI GOROU |
分类号 |
H01L21/60;H01L21/607;H01L23/498;H05K1/11;H05K3/32;(IPC1-7):H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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