| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder processing unit for excellently maintaining productivity of a soldering process, while cleaning the iron tip.SOLUTION: A solder processing unit comprises at least a first solder iron part and a second solder iron part as a solder iron part having the substantially cylindrical iron tip having a supply hole used for supplying solder to a substrate and executes melting processing for melting the supplied solder and cleaning processing for removing a residue of the solder stuck to the iron tip, and the solder processing unit executes first operation for executing the cleaning processing to the second solder iron part while executing the melting processing by the first solder iron part and second operation for executing the cleaning processing to the first solder iron part while executing the melting processing by the second solder iron part.SELECTED DRAWING: Figure 4 |
