发明名称 Thin film transistor, manufacturing method thereof and thin film transistor array substrate
摘要 The present invention discloses a thin film transistor, comprising an active layer, a gate insulating layer, a gate electrode, a source electrode, and a drain electrode formed on a substrate. The active layer is above the substrate. The gate insulating layer, the source electrode, and the drain electrode are above the active layer. The gate electrode is above the gate insulating layer. Wherein, the thin film transistor further comprises a shielding layer between the substrate and the active layer, the shielding layer is used to absorb external light. The thin film transistor according to the present invention not only has strong stability, but also has high output efficiency. Moreover, the thin film transistor can follow the existing process, which facilitates mass production. The present invention further discloses a manufacturing method of the thin film transistor and a thin film transistor array substrate using the thin film transistor.
申请公布号 US9397221(B2) 申请公布日期 2016.07.19
申请号 US201314235063 申请日期 2013.12.05
申请人 Shenzhen China Star Optoelectronics Technology Co., Ltd 发明人 Su Chih-yu
分类号 H01L29/786;H01L21/02;H01L27/12;H01L29/24;H01L29/66 主分类号 H01L29/786
代理机构 代理人 Cheng Andrew C.
主权项 1. A manufacturing method of thin film transistor, comprising the following steps: A. forming a shielding layer on a substrate; B. forming an active layer on the shielding layer; C. forming a gate insulating layer on the active layer, and patterning the gate insulating layer, so that a first zone and a second zone of the active layer are exposed; D. forming a gate electrode on the gate insulating layer; E. forming a passivation layer on the substrate, the first zone, the second zone, and a gate electrode, and pattering the passivation layer, so that the first zone and the second zone are exposed; F. forming a source electrode and a drain electrode on the passivation layer, and the source electrode and the drain electrode respectively contacting with the first zone and the second zone; and wherein a ratio of using gases as depositing the gate insulating layer is SiH4/N2O<1/65, and the ratio of using gases as depositing the passivation layer is SiH4/N2O>1/50.
地址 Shenzhen, Guangdong CN