发明名称 受光素子および光結合型信号絶縁装置
摘要 A light receiving element includes: a semiconductor layer; an insulating layer; an interconnect layer; and a film. The semiconductor layer includes a light receiving unit configured to convert a signal light incident on the light receiving unit into an electrical signal. The insulating layer is provided on the semiconductor layer. The interconnect layer is provided on the insulating layer. The film is provided on the insulating layer to cover the light receiving unit and be connected to the interconnect layer, the film being made of a metal or a metal nitride.
申请公布号 JP5956968(B2) 申请公布日期 2016.07.27
申请号 JP20130190503 申请日期 2013.09.13
申请人 株式会社東芝 发明人 日高 美樹;高田 修;西郡 正人;瀧場 由貴子;鈴永 浩;下村 弘
分类号 H01L31/10;H01L21/3205;H01L21/768;H01L23/522;H01L31/12 主分类号 H01L31/10
代理机构 代理人
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