发明名称 METHOD OF MANUFACTURING INSULATION SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an insulation substrate having high heat conduction characteristics and a high degree of design freedom with respect to a thermal cycle load and also to provide a method of manufacturing the same.SOLUTION: A method of manufacturing an insulation substrate 20A includes: a blazing step of joining a wiring layer 1 and an insulation layer 2 in a laminar form by blazing. The wiring layer 1 is made of aluminum and a carbon material. A first Ni plating layer 11 is formed on a surface 1a to be joined with the insulation layer 2 of the wiring layer 1 before the blazing step. In the blazing step, the wiring layer 1 and the insulation layer 2 are joined to each other by blazing in a state where a first aluminum brazing material layer 6 is interposed between the first Ni plating layer 11 of the wiring layer 1 and the insulation layer 2.SELECTED DRAWING: Figure 3
申请公布号 JP2016152241(A) 申请公布日期 2016.08.22
申请号 JP20150027212 申请日期 2015.02.16
申请人 SHOWA DENKO KK 发明人 MINAMI KAZUHIKO
分类号 H01L23/36;H01L23/12 主分类号 H01L23/36
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