PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMMUNICATIONS BETWEEN PACKAGE COMPONENTS

摘要

Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

主权项

1. A semiconductor device, comprising:
a semiconductor wafer comprising:
an integrated waveguide;a first integrated circuit die; anda second integrated circuit die; wherein the first and second integrated dies of the semiconductor wafer are coupled to the integrated waveguide of the semiconductor wafer; and wherein the first and second integrated circuit dies of the semiconductor wafer are configured to communicate by transmitting signals using the integrated waveguide of the semiconductor wafer.