SUBSTRATE WITH EMBEDDED SINTERED HEAT SPREADER AND PROCESS FOR MAKING THE SAME

摘要

The present disclosure relates to a substrate with an embedded sintered heat spreader and a process for making the same. According to an exemplary process, at least one cavity is created through the substrate. Sinterable paste including metal particulates and binder material is then dispensed into the at least one cavity. Next, the sinterable paste is sintered to create a sintered heat spreader, which is characterized by high thermal conductivity. The sintered heat spreader adheres to the inside walls of the at least one cavity, enhancing the overall thermal conductivity of the substrate.

主权项

1. A method comprising:
providing a substrate having a top surface and a bottom surface opposite the top surface; creating at least one cavity that extends through the substrate from the top surface of the substrate to the bottom surface of the substrate; dispensing sinterable paste into the at least one cavity, wherein the sinterable paste comprises metal particulates with sub-nano-meter dimensions and binder material coating each of the metal particulates; and sintering the sinterable paste to create a sintered heat spreader in the substrate.