Barrier Configurations and Processes in Layer Structures

摘要

This invention relates generally to ID frequency identification (RFID) transponders and receivers. More specifically to the methods, apparatus and systems of the fabrication of the transponders and receivers. In one example embodiment, to methods, apparatus, and systems to form effective barriers for devices having a layer structure, including encapsulating at least a portion of the side of the devices from being degraded due to impurity penetration into a laminate structure of the devices, which can cause corrosion or malfunction of the devices.

主权项

1. A method comprising:
providing a product on at least one substrate, wherein:
the product is at least one RFID device which has multiple elements, wherein:
a first element is at least one RFID antenna,a second element is at least one RFID IC,a third element is at least one adhesive layer; cutting out the product, wherein:
the cut exposes at least one element to an ambient, wherein the ambient degrades the element; encapsulating the product, wherein:
an encapsulation material provides a barrier for at least one element from the ambient.