发明名称 |
IMMERSION FIELD GUIDED EXPOSURE AND POST-EXPOSURE BAKE PROCESS |
摘要 |
Methods disclosed herein provide apparatus and method for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes. In one embodiment, an apparatus includes a processing chamber comprising a substrate support having a substrate supporting surface, a heat source embedded in the substrate support configured to heat a substrate positioned on the substrate supporting surface, an electrode assembly configured to generate an electric field in a direction substantially perpendicular to the substrate supporting surface, wherein the electrode assembly is positioned opposite the substrate supporting surface having a downward surface facing the substrate supporting surface, wherein the electrode assembly is spaced apart from substrate support defining a processing volume between the electrode assembly and the substrate supporting surface, and a confinement ring disposed on an edge of the substrate support or the electrode assembly configured to retain an intermediate medium. |
申请公布号 |
US2016357107(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
US201514733923 |
申请日期 |
2015.06.08 |
申请人 |
Applied Materials, Inc. |
发明人 |
BUCHBERGER, JR. Douglas A.;NAM Sang Ki;BABAYAN Viachslav;OUYANG Christine Y;GODET Ludovic;NEMANI Srinivas D. |
分类号 |
G03F7/20 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
1. An apparatus for processing a substrate, the apparatus comprising:
a processing chamber, the processing chamber comprising:
a substrate support having a substrate supporting surface;a heat source embedded in the substrate support configured to heat a substrate positioned on the substrate supporting surface;an electrode assembly configured to generate an electric field in a direction substantially perpendicular to the substrate supporting surface, wherein the electrode assembly is positioned opposite the substrate supporting surface having a downward surface facing the substrate supporting surface, wherein the electrode assembly is spaced apart from substrate support defining a processing volume between the electrode assembly and the substrate supporting surface; and a confinement ring disposed on an edge of the substrate support or the electrode assembly configured to retain an intermediate medium. |
地址 |
Santa Clara CA US |