| 摘要 |
PURPOSE:To prevent development of nicks or cracks by connecting a cleavage surface provided on a side circumference surface and a front and a rear with a smooth arc surface and by specifying an angle of chamfer which is a crossing angle formed by the cleavage surface and the arc curved surface. CONSTITUTION:A semiconductor wafer is provided with a flat surface SIGMA, an arc surface UPSILON which constitutes a periphery thereof, and a cleavage surface PIto show direction. The arc surface UPSILON is chamfered. A connection section of the surface SIGMA and the cleavage surface PI is chamfered not to be square. The surface SIGMA and the cleavage PI are connected by a smooth curve JMK. An angle (-) formed with the cleavage PI at a point K is; 135 deg.<=(-)<=180 deg.. Since an orientation flat is a cleavage surface, a positioning accuracy does not deteriorate. Nicks, cracks, etc., are difficultly developed as a cleavage surface and a surface are connected with.
|
