| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing process of a multilayered flex-rigid printed wiring board and improve its drilling machinability, by applying a bonding agent containing specific components to the circuit surface of a rigid circuit board to dry thereafter the bonding agent and bring it into a semi-hardened state, and by heating and pressing this bonding-agent-bearing rigid circuit board and a cover-bearing flexible circuit board to integrate both the circuit boards with each other. SOLUTION: In a bonding-agent-bearing rigid circuit board, there is used an epoxy resin bonding agent containing respectively as a hardening agent, bis-p-aminobenzoate expressed by a chemical formula as shown (where m, n denote respectively integers of 1-12 and (m×n) is not larger than 12}, and as a hardening accelerator, an epoxy resin composite having boron trifluoride complex compound as its essential component. In this case, especially, the bonding-agent-bearing rigid circuit board is adjusted in its drying process to bring it into such a semi-hardened state that the flow of the bonding agent is made not larger than 0.5mm in the case of the heating and pressing of the conditions of 160 deg.C and 40kgf/cm<2> . Thereby, the manufacturing process of a multilayered flex-rigid printed wiring board is reduced and its drilling machinability can be made excellent. |
