发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To improve sensitivity, resolving power and shelf stability, to enable curing at a low temp. and to reduce the residual stress of a film by incorporating a specified polyamic acid compd., a specified polyamic ester, compd., a photosensitive auxiliary having a photopolymerizable functional group, a photopolymn. initiator and a solvent. SOLUTION: This compsn. contains a polyamic acid compd. having at least one of actinic ray functional groups Z<1> represented by formula I and Z<2> represented by formula II, a polyamic ester compd. obtd. by esterifiying the carboxyl groups of a polyamic acid compd. with photocrosslinkable groups, a photosensitive auxiliary having a photopolymerizable functional group, a photopolymn. initiator and a solvent. In the formula I, X is a single bond, -O-, etc., each of R<3> -R<7> is a substituent having a photopolymerizable C-C double bond, (m) is 0 or 1 and (n) is an integer of 1-3. In the formula II, each of R<3> -R<7> is a substituent having a photopolymerizable C-C double bond and (m) is 0 or 1.
申请公布号 JPH09258440(A) 申请公布日期 1997.10.03
申请号 JP19960090243 申请日期 1996.03.19
申请人 NIPPON ZEON CO LTD;FUJITSU LTD 发明人 TANAKA AKIRA;SAKAMOTO KEI;ITO KENICHI;YONEDA YASUHIRO;YOKOUCHI KISHIO;MIZUTANI DAISUKE;ISHIZUKI YOSHIKATSU
分类号 G03F7/027;C08L79/08;G03F7/038;H01L21/027;H01L21/312;(IPC1-7):G03F7/027 主分类号 G03F7/027
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