发明名称 |
Radio frequency module and method for fabricating the radio frequency module |
摘要 |
The radio frequency module of the present invention includes an insulating substrate having a first metal film on a first principal surface thereof and a second metal film on a second principal surface thereof opposed to the first principal surface and a semiconductor device. The semiconductor device is thermally and electrically coupled to the second metal film, and a thickness of the second metal film is larger than that of the first metal film. <IMAGE> |
申请公布号 |
EP0818823(A2) |
申请公布日期 |
1998.01.14 |
申请号 |
EP19970109577 |
申请日期 |
1997.06.12 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ISHIKAWA, OSAMU;MAEDA, MASAHIRO |
分类号 |
H01L23/66 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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