SPIN CLEANING METHOD AND APPARATUS THEREFOR

摘要

PROBLEM TO BE SOLVED: To clean works with a cleaning liq. involved radially inward in a cleaning brush by feeding the cleaning liq. at a position where the rotation of the works involves the liq. in the brush. SOLUTION: A nozzle 35 is set at a tilt angleθ1 at which it directs to the contact zone of a semiconductor wafer 22 and cleaning brush 31a and at a horizontal angle so that it sprays the cleaning liq. forwards in the revolving direction of the arm 33 near the radially outwards of the brush 31a and at the upstream side in the rotating direction of the wafer 22 from the brush 31a. Thus the cleaning liq. sprayed on the wafer from the nozzle 35 collides against the brush 31a before diffusing over the wafer owing to the revolution of the arm 33 and rotation of the wafer 22. As a result, the liq. is involved radially inwards in the brush 31a.