发明名称 |
Electroless nickel plating solution and method |
摘要 |
To an electroless nickel plating solution comprising a water-soluble nickel salt, a reducing agent, and a complexing agent is added a polythionate or dithionite. The invention also provides a high-build electroless gold plating method comprising the steps of immersing a workpiece in the electroless nickel plating bath, thereby chemically depositing a nickel coating on the workpiece, and immersing the nickel-plated workpiece in an electroless gold plating bath, thereby chemically depositing a gold coating on the workpiece.
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申请公布号 |
US5910340(A) |
申请公布日期 |
1999.06.08 |
申请号 |
US19970931832 |
申请日期 |
1997.09.17 |
申请人 |
C. UYEMURA & CO., LTD. |
发明人 |
UCHIDA, HIROKI;KISO, MASAYUKI;NAKAMURA, TAKAYUKI;KAMITAMARI, TOHRU;SUSUKI, RUMIKO;SHIMIZU, KOICHIRO |
分类号 |
C23C18/34;C23C18/42;(IPC1-7):H01L21/302 |
主分类号 |
C23C18/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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