发明名称 |
Process for producing printed wiring board |
摘要 |
<p>In an additive process for producing printed wiring boards, by using a developer (103) comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material (101) a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible. <IMAGE></p> |
申请公布号 |
EP0584780(B1) |
申请公布日期 |
1999.11.03 |
申请号 |
EP19930113478 |
申请日期 |
1993.08.24 |
申请人 |
HITACHI, LTD. |
发明人 |
MIYAZAKI, MASASHI;AKAHOSHI, HARUO;NOHARA, SHOZO;KIKUTA, KENZI;ISHIMARU, TOSHIAKI |
分类号 |
G03F7/033;G03F7/30;G03F7/32;H05K3/00;H05K3/10;H05K3/18;(IPC1-7):H05K3/10 |
主分类号 |
G03F7/033 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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