发明名称 Process for producing printed wiring board
摘要 <p>In an additive process for producing printed wiring boards, by using a developer (103) comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material (101) a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible. <IMAGE></p>
申请公布号 EP0584780(B1) 申请公布日期 1999.11.03
申请号 EP19930113478 申请日期 1993.08.24
申请人 HITACHI, LTD. 发明人 MIYAZAKI, MASASHI;AKAHOSHI, HARUO;NOHARA, SHOZO;KIKUTA, KENZI;ISHIMARU, TOSHIAKI
分类号 G03F7/033;G03F7/30;G03F7/32;H05K3/00;H05K3/10;H05K3/18;(IPC1-7):H05K3/10 主分类号 G03F7/033
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