FABRICATING A HYBRID IMAGING DEVICE

摘要

A hybrid detector (100) or imager includes two substrates (102, 106) fabricated under incompatible processes. An array of detectors (104), such a s charged-coupled devices, are formed on the first substrate using a CCD fabrication process, such as a buried channel or peristaltic process. One or more charge-converting amplifiers (114) are formed on a second substrate usi ng a CMOS fabrication process. The two substrates are then bonded together to form a hybrid detector.