Method for fabricating a multi-layer body, especially a chip card, by milling of a slot for insertion of a chip module with a separation layer having previously been inserted so that cavity material is easily removed

摘要

Method in which the body (1) is milled along the peripheral border (10) of a cavity (2) that is to be created to produce a peripheral slot (11) so that an island of material (17) is created surrounded by the slot. To facilitate the separation of the material island a separation layer (9) is inserted in the multi-layer body when the layers are combined. Thus the material island is easily removed.