WAVELENGTH-CONVERTED LIGHT EMITTING DEVICE PACKAGE

摘要

A wavelength-converted light emitting device package is provided to increase total luminance thereof by increasing the amount of light extracted from the package. A package structure(21) includes a groove part having a bottom surface and an inclined inner sidewall toward an upper part. A stepped part is formed at a top end of the inner sidewall of the groove part to extend an opening of the groove part. A first and a second wiring structure are formed at the package structure to be exposed to the bottom surface of the groove part. A semiconductor LED chip(25) is mounted on the bottom surface of the groove part to be electrically connected to the first and second wiring structures. A transparent resin package unit(27) is formed toward an extended region to surround the semiconductor LED chip. A phosphor layer(28) is formed on an upper surface of the transparent resin package unit to convert a wavelength of the light emitted from the semiconductor LED chip. The phosphor layer is more than a thickness of a particle layer and has a thickness range of 200 mum and less.