Semiconductor device including bonding portion with first and second sealing materials

摘要

A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.

主权项

1. A semiconductor device comprising
a first substrate; a transistor over the first substrate; a light emitting element over the transistor; an insulating film over the light emitting element; a second substrate over the insulating film; a conductive layer over the second substrate, the conductive layer being electrically connected to a flexible printed circuit; a bonding portion interposed between the first substrate and the second substrate, the bonding portion being disposed along peripheries of the first substrate and the second substrate, wherein the bonding portion comprises a first region and a second region, wherein the first region comprises a first sealing material, wherein the second region comprises a second sealing material, and wherein the second sealing material is in contact with a side surface of the first substrate and a side surface of the second substrate.