| 摘要 |
A drive circuit device includes a circuit board having a multilayer structure, which includes first to fourth circuit conductor layers, and first to third insulating layers; and heat sinks that dissipate heat of the circuit board to an outside. An upper FET state is embedded in the first insulating layer, and a lower FET state is embedded in the second insulating layer. The upper FET and the lower FET are disposed so that a region in which the upper FET is positioned and a region in which the lower FET is positioned overlap each other in a stacking direction. A lead-out portion is formed at a second circuit pattern of the circuit conductor layer, the lead-out portion extending from the circuit board in a direction orthogonal to the stacking direction, and being connected to the heat sinks so that heat is transferred to the heat sinks. |
| 主权项 |
1. A drive circuit device comprising:
a circuit board in which a drive circuit is formed, the drive circuit including a plurality of switching arms connected in parallel, and each of the switching arms including a first switching element and a second switching element that are connected in series; and a heat-dissipating unit that dissipates heat of the circuit board to an outside, wherein the circuit board is a board having a multilayer structure in which multiple circuit conductor layers are stacked with insulating layers being interposed between the circuit conductor layers, the circuit conductor layers including circuit patterns made of a conductive material, wherein the first switching elements and the second switching elements are provided in the circuit board so that a circuit conductor layer of the circuit conductor layers is sandwiched from both sides in the stacking direction between all of the first switching elements and all of the second switching elements so that heat from each of the first switching elements dissipates through the circuit conductor layer and heat from each of the second switching elements also dissipates through the circuit conductor layer, wherein a region in which the first switching elements are positioned and a region in which the second switching elements are positioned overlap each other in a stacking direction, wherein a lead-out portion is formed at the circuit pattern of the circuit conductor layer interposed between the first switching elements and the second switching elements, and wherein the lead-out portion extending from the circuit board in a direction orthogonal to the stacking direction, and being connected to the heat-dissipating unit so that heat is transferred to the heat-dissipating unit. |
