SUBSTRATE HOLDER, METHOD FOR HOLDING SUBSTRATE WITH SUBSTRATE HOLDER, AND PLATING DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce a thickness of a plating film of a die located adjacent to a portion where a pattern is not formed in a resist to improve the film thickness uniformity on a substrate surface.SOLUTION: A substrate holder according to the invention includes: a holding surface 57 for holding a substrate; a second holding member 60 which has an opening part 63 for exposing the holding surface 57 and is configured to press the substrate placed on the holding surface 57 against the holding surface 57 to hold the substrate; and a shield plate 65 which protrudes to the radial inner side of the opening part 63 of the second holding member 60 and shields a part of the substrate. The shield plate 65 is configured so as to move along the opening part 63.SELECTED DRAWING: Figure 2