发明名称 Methods of removing residual polymers formed during a boron-doped amorphous carbon layer etch process
摘要 Methods for removing residual polymers formed during etching of a boron-doped amorphous carbon layer are provided herein. In some embodiments, a method of etching a feature in a substrate includes: exposing a boron doped amorphous carbon layer disposed on the substrate to a first plasma through a patterned mask layer to etch a feature into the boron doped amorphous carbon layer, wherein the first plasma is formed from a first process gas that reacts with the boron doped amorphous carbon layer to form residual polymers proximate a bottom of the feature; and exposing the residual polymers to a second plasma through the patterned mask layer to etch the residual polymers proximate the bottom of the feature, wherein the second plasma is formed from a second process gas comprising nitrogen (N2), oxygen (O2), hydrogen (H2), and methane (CH4).
申请公布号 US9390923(B2) 申请公布日期 2016.07.12
申请号 US201414324000 申请日期 2014.07.03
申请人 APPLIED MATERIALS, INC. 发明人 Yoo Jeong Hyun;Lee Hoon Sang;Kong Byungkook
分类号 H01L21/302;H01L21/033;H01L21/3065;H01L21/32 主分类号 H01L21/302
代理机构 Moser Taboada 代理人 Moser Taboada ;Taboada Alan
主权项 1. A method of etching a feature in a substrate, comprising: exposing a boron doped amorphous carbon layer disposed on the substrate to a first plasma through a patterned mask layer to etch a feature into the boron doped amorphous carbon layer, wherein the first plasma is formed from a first process gas that reacts with the boron doped amorphous carbon layer to form residual polymers proximate a bottom of the feature; and exposing the residual polymers to a second plasma through the patterned mask layer to etch the residual polymers proximate the bottom of the feature, wherein the second plasma is formed from a second process gas consisting of nitrogen (N2), oxygen (O2), hydrogen (H2), and methane (CH4).
地址 Santa Clara CA US