发明名称 Double-clip apparatus for radiant floor heat system
摘要 An apparatus may include a first clip configured to receive a first portion of radiant heat tubing, a second clip configured to receive a second portion of radiant heat tubing, and an interconnecting brace. The interconnecting brace is connected to a base portion of the first clip and a base portion of the second clip, wherein the interconnecting brace is at least 3 inches long.
申请公布号 US9400117(B2) 申请公布日期 2016.07.26
申请号 US201514591452 申请日期 2015.01.07
申请人 Jacobs Gary L. 发明人 Jacobs Gary L.
分类号 F24D3/14;F16L3/237;F16M11/10;B60R11/00;H02G3/30;F16L3/02 主分类号 F24D3/14
代理机构 Suiter Swantz pc llo 代理人 Suiter Swantz pc llo
主权项 1. A subfloor mountable double-clip apparatus for a radiant floor heat system, comprising: a first clip including a first clip support structure and a first clip portion, the first clip portion shaped to uninterruptedly surround a majority of a first circumferential portion of radiant heat tubing; a second clip including a second clip support structure and a second clip portion, the second clip portion shaped to uninterruptedly surround a majority of a second circumferential portion of radiant heat tubing; and an interconnecting brace including a first side and an opposite side being opposite the first side, the interconnecting brace being connected to the first clip support structure of the first clip and the second clip support structure of the second clip on the first side of the interconnecting brace, wherein the first clip support structure of the first clip is perpendicularly positioned between the interconnecting brace and the first clip portion, wherein the second clip support structure of the second clip is perpendicularly positioned between the interconnecting brace and the second clip portion, wherein the opposite side of the interconnecting brace includes at least two cavities, wherein the interconnecting brace is at least 3 inches long, the interconnecting brace including a flat surface opposite a side of the interconnecting brace that is connected to the first clip support structure and the second clip support structure such that the flat surface is configured to be positioned against a subfloor when the subfloor mountable double-clip apparatus for the radiant heat system is mounted to the subfloor, wherein the first clip is oriented with respect to the interconnecting brace so as to hold a portion of radiant heat tubing extending through the first clip in a direction at least substantially perpendicular to a lengthwise direction of the interconnecting brace, wherein the second clip is oriented with respect to the interconnecting brace so as to hold a portion of radiant heat tubing extending through the second clip in a direction at least substantially perpendicular to the lengthwise direction of the interconnecting brace, wherein the interconnecting brace includes at least three holes positioned between the first clip and the second clip, each of the at least three holes positioned along the interconnecting brace at points along a line passing between the first clip support structure and the second clip support structure, each of the at least three holes configured to receive attachment means, the at least three holes including a first end mounting hole, a center mounting hole, and a second end mounting hole, wherein each of the at least three holes are countersunk, wherein the flat surface opposite a side of the interconnecting brace that is connected to the first clip support structure and the second clip support structure of the interconnecting brace includes the at least two cavities including a first cavity positioned between the first end mounting hole and the center mounting hole and a second cavity positioned between the center mounting hole and the second end mounting hole, wherein the first clip, the second clip, and the interconnecting brace are composed of a single piece of material.
地址 Bennington NE US