Method for partially stripping a defined area of a conductive layer

摘要

A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.

主权项

1. A method for partial detachment, using a laser beam, of a defined area of a conductive layer supported by an underlying substrate, the method comprising:
forming a conductor track, completely within the defined area, with a defined path from a portion of the conductive layer supported by the underlying substrate, the path defining main axes (X, Y); providing a plurality of linear recesses, by a laser directly applied to the conductive layer, extending, in a direction that is not parallel to either of the main axes (X, Y), and excluding respective end regions of the plurality of linear recesses, in a direction that is aligned at an acute angle with respect to edges of the conductor track, from at least one of an edge of the defined area or an edge of the conductor track to at least one of another edge of the defined area or another edge of the conductor track,
wherein providing the plurality of linear recesses segments the defined area into a plurality of zones to be removed, each zone to be removed extending from at least one of an edge of the defined area or an edge of the conductor track to at least one of another edge of the defined area or another edge of the conductor track,wherein each of the plurality of linear recesses defines a portion of a perimeter of at least one of a plurality of strip-shaped zones to be removed and,wherein each of the plurality of linear recesses thermally insulates an outer edge region of at least one of the plurality of strip-shaped zones to be removed from adjoining ones of the plurality of strip-shaped zones to be removed; and heating a portion of a first of the zones to be removed using laser radiation provided by a laser beam until adhesion of the conductive layer to the underlying substrate is substantially reduced and the portion can be detached in a surface-wide manner from the underlying substrate under external influences, wherein laser-beam parameters of the laser beam providing the laser radiation are set such that the conductive layer can be detached without affecting the underlying substrate.