发明名称 ELECTROSTATIC CHUCK ASSEMBLY AND PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve uniformity of electric flux above a workpiece during a plasma processing process.SOLUTION: An electrostatic chuck assembly 100 having a dielectric material 108 and/or having a cavity 106 with varying thickness, profile and/or shape includes a conductive support 102 and an electrostatic chuck ceramic layer 104. A dielectric layer or insert 108 is located between the conductive support 102 and an electrostatic chuck ceramic layer 104. A cavity 106 is located in a seating surface of the electrostatic chuck ceramic layer 104. An embedded pole pattern can be optionally incorporated in the electrostatic chuck assembly.SELECTED DRAWING: Figure 1
申请公布号 JP2016149574(A) 申请公布日期 2016.08.18
申请号 JP20160092481 申请日期 2016.05.02
申请人 LAM RESEARCH CORPORATION 发明人 DINJAR RAJINDER;LENTZ ERIC;LI LIU-MIN;KOZAKEVICH FELIX
分类号 H01L21/683;H01L21/3065;H02N13/00 主分类号 H01L21/683
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