Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation

摘要

Trapped sacrificial structures and thin-film encapsulation methods that may be implemented to manufacture trapped sacrificial structures such as relative humidity sensor structures, and spacer structures that protect adjacent semiconductor structures extending above a semiconductor die substrate from being contacted by a molding tool or other semiconductor processing tool in an area of a die substrate adjacent the spacer structures.

主权项

1. A trapped sacrificial structure, comprising:
a MEMS region disposed over a substrate, the MEMS region including a MEMS structural layer; a portion of a first sacrificial layer and a portion of a second sacrificial layer disposed over the MEMS structural layer; an upper microshell layer disposed over the portions of the first and second sacrificial layers, the first sacrificial layer portion and/or a second sacrificial layer portion being configured to form at least one trapped sacrificial structure under the upper microshell layer; and one or more upper release holes defined in the upper microshell layer.