| 摘要 |
Provided is a bonding device for a display panel; the bonding device is capable of significantly reducing the defect rate for a bonded body by reliably removing bubbles occurring after bonding while preventing bubbles from being sealed in the bonding surface during bonding to thus increase the productivity of the bonding operation. A vacuum chamber unit 3 is constituted by a chamber body 10 and a chamber cover 11. A fixed bonding base 12 equipped with a damming jig 13 is provided in the chamber body 10, and a movable bonding base 16 is provided in the chamber cover 11. A display panel P1 and an object to be bonded P2, attached to the damming jig 13 and the movable bonding base 16, are bonded in a vacuum; subsequently an unsealed portion 34 not sealed by the damming jig 13 is positioned at the inclined upper end of the display panel P1 with the vacuum chamber unit 3 inclined using a chamber tilting device to thereby remove the bubbles occurring on the bonding surface during the curing process of an adhesive from the unsealed portion 34. |
