发明名称 THERMOPLASTIC RESIN COMPOSITION AND SEALED ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition excellent in moldability and moisture resistance, greatly improved in molding strain, and suitable for sealing by using a thermoplastic aromatic resin and a thermoplastic aromatic norbornene based resin as the constituents. SOLUTION: This composition contains a thermoplastic aromatic resin (A) having aromatic ring(s) in the backbone and a thermoplastic aromatic norbornene based resin (B) comprising, e.g. a ring-opening polymer of an aromatic norbornene monomer, a ring-opening copolymer of an aromatic norbornene monomer, with a nonaromatic norbornene monomer, or an adduct of an aromatic norbornene monomer with an aromatic vinyl compound at a weight ratio of component A to component B of (5:95) to (95:5). If necessary, other synthetic resin, an elastomer, and various additives can be blended with the composition.
申请公布号 JPH10130473(A) 申请公布日期 1998.05.19
申请号 JP19960305994 申请日期 1996.10.31
申请人 NIPPON ZEON CO LTD 发明人 HOSAKA SUSUMU;TSUNOKAI YASUO
分类号 C08L65/00;C08L45/00;C08L67/03;C08L67/04;C08L71/00;C08L71/10;C08L81/02;H01L23/29;H01L23/31;(IPC1-7):C08L65/00 主分类号 C08L65/00
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