| 摘要 |
<p>A semiconductor module is mounted on a printed circuit board so that a heat radiating surface of the module and surfaces of the printed circuit boards are parallel to inner wall surfaces of a unit case. The total thickness of the semiconductor module constituting an inverter essential to a servo amplifier, and the printed circuit boards on which the semiconductor module is mounted is made substantially equal to a distance between the inner walls of the unit case so that the width of the servo amplifier can be minimized. The other components having sizes smaller than the width of the unit case are selected, and an electrolytic capacitor and the like are divided into a plurality of parts so that the divided parts are separately accommodated. Further, air passages are defined by guide plates closing gaps between the components, so that air is impinge concentratedly on components which need to be cooled during forced air cooling by fans, whereby the cooling efficiency is enhanced, permitting dense arrangement of the components and making it possible to provide a servo amplifier reduced in thickness and in size. <IMAGE></p> |
