| 发明名称 |
Integrated circuit dielectric and method |
| 摘要 |
A surface treatment for porous silica to enhance adhesion of overlying layers. Treatments include surface group substitution, pore collapse, and gap filling layer (520) which invades open surface pores (514) of xerogel (510).
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| 申请公布号 |
US6008540(A) |
申请公布日期 |
1999.12.28 |
| 申请号 |
US19980087458 |
申请日期 |
1998.05.28 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
LU, JIONG-PING;JIN, CHANGMING |
| 分类号 |
H01L21/3105;H01L21/314;H01L21/316;H01L21/762;H01L21/768;H01L23/29;H01L23/522;H01L23/532;(IPC1-7):H01L23/48;H01L23/58;H01L47/00 |
主分类号 |
H01L21/3105 |
| 代理机构 |
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| 主权项 |
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