| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for holding and positioning a substrate by which the machining precision and reproducibility on laser beam machining of a substrate can be improved. <P>SOLUTION: In the apparatus, a vacuum plate 1 with a substrate mounted on it has a flat upper surface, is provided with a vacuum-distribution system which can be connected to a vacuum generator at its lower surface, and further, is provided with a plurality of suction holes 3 between the upper surface and the vacuum-distribution passage . The plate 1 comprises a cooling system (cooling circuit) consisting of cooling passages 7 and 8, the cooling system is filled with a cooling medium, and a connection (such as a connection tube piece) to a cooling apparatus 10 is provided. <P>COPYRIGHT: (C)2004,JPO |
