| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board and a semiconductor device, where a power supply and a grounding part are efficiently arranged on each layer inside a board so as to enable both general signal wires and differential signal wires to have optimal impedance characteristics respectively. SOLUTION: General signal wires 1-1, 1-2, 1-3, and 1-4 and differential signal wires 4-1 and 4-1 are arranged on different planes. On the plane where the differential signal wire is arranged, the differential signal wire is arranged in a first region, and either power supply planes 12-1 and 12-3 or a ground plane is arranged in a second region. The general signal wires are arranged as laminated in a vertical direction in the second region, by which both the general signal wires and the differential signal wires are arranged between the power supply plane and the grounding plane. |
