| 摘要 |
PROBLEM TO BE SOLVED: To obtain a conducting connecting part of simple structure which can be used to constitute a reliable unit semiconductor device or laminated semiconductor device, a manufacturing method therefor, and such a semiconductor device. SOLUTION: A connector for conduction 1A is formed by arranging in parallel a plurality of conductors 2 with the central portions thereof insulated by insulating resin P with a specified distance left in-between, and bending the conductors in U shape so that one-side ends of the conductors 2 as front face- side connecting portions 3 and the other-side ends as rear face-side connecting portions 4 are substantially parallel to each other with a distance equivalent to the thickness of an IC chip Sa left in-between. The connector for conduction 1A is attached to the IC chip Sa from the flank, and the front face-side connecting portions 3 are respectively connected with a plurality of bumps 11 to form a unit semiconductor device 10A and 10C. A plurality of such semiconductor devices 10A and 10C are stacked to form laminated semiconductor devices 10B, 10D, and 10E. |
