| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor from which a formed article allowing a light in a visible light region to pass while selectively cutting the light having wave lengths in an ultraviolet region and a near infrared region can be formed. <P>SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent, a curing accelerator and a boron compound. The formed article formed into a shape having 1 mm thickness has ≥20% transmittance of the light having 580 nm wave length, and ≤1% transmittance of the light having 940 nm wave length. By the composition, the transmittances of the near infrared light and the ultraviolet light through the epoxy resin composition for sealing the semiconductor are reduced by the boron compound, but the transmittance of the visual light is kept. <P>COPYRIGHT: (C)2008,JPO&INPIT |
