发明名称 PLATING EQUIPMENT AND PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To perform plating with high productivity even when a plating process at high temperature is used. SOLUTION: A revolving shaft 3 is connected to an agitator 2 and a container 5 housing a plurality of works 4 are connected to the revolving shaft 3. Also, the revolving shaft 3 is installed at an angle inclined from a perpendicular direction and the container 5 is immersed into an electrolyte 6 for plating. Also, the revolving shaft 3 is formed to a hollow cylindrical shape and a conducting line 7 is inserted therein. One end of the conducting line 7 is connected to a power source and the other end is disposed within the container 5. The container 5 is made of metal and is provided with a plurality of openings. Otherwise, the container is formed of metallic mesh, provided that its surface is coated with an insulating layer. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008223109(A) 申请公布日期 2008.09.25
申请号 JP20070066100 申请日期 2007.03.15
申请人 HITACHI METALS LTD 发明人 HOSHI HIROYUKI;ANDO SETSUO;OKAMOTO ATSUSHI
分类号 C25D17/24;C25D3/44 主分类号 C25D17/24
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