| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin-molding material for sealing, excellent in flowability and solder reflow resistance without decreasing curing property, and an electronic part device equipped with an element sealed by the same. SOLUTION: This epoxy resin-molding material for sealing containing (A) an epoxy resin, (B) a curing agent and (C) an acrylic compound is provided with that (C) the acrylic compound is obtained by polymerizing compounds expressed by general formulas (I), (II) and (III). COPYRIGHT: (C)2008,JPO&INPIT
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