| 摘要 |
PROBLEM TO BE SOLVED: To provide a production method for a resist structure that is suitable for forming a microbump and has a larger inner space than a height of a bump.SOLUTION: In a production method for a microbump relating to the present invention, a resist structure R, which is disposed on one surface of a process target body 10 and has an inner space having a predetermined opening and a height in a micrometer order, is used as a mask to produce a microbump by sputtering in a specific region on the one surface of the process target body facing the inner space. The method includes: a step X of depositing sputtered particles passing through the opening on the specific region to form a desired adherend 20; a step Y of removing the resist structure to leave the adherend on the one surface of the process target body; and a step Z of subjecting the adherend to heat treatment.SELECTED DRAWING: Figure 2 |
