| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of efficiently transmitting a high frequency signal.SOLUTION: A wiring board A includes a through-conductor 16 electrically connected to each external connection pad 19 in an insulation substrate 10, at least a pair of external connection pads 19a for a differential signal adjacent to each other and a plurality of external pads 19b for grounding or for power supply being formed in a two-dimensional array at a lower surface of the insulation substrate 10. The diameter d1 and the array pitch P1 of the external connection pads 19a for a differential signal are smaller than the diameter d2 and the array pitch P2 of the external connection pads 19b for grounding or for power supply, and the array pitch P3 of through-conductors 16a connected to the external connection pads 19a for a differential signal is equal to or less than the array pitch P1 of the external connection pads 19a for a differential signal.SELECTED DRAWING: Figure 2 |
