发明名称 Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component
摘要 There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1):; wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.
申请公布号 US9395626(B2) 申请公布日期 2016.07.19
申请号 US201214364498 申请日期 2012.10.31
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 Tanimoto Akitoshi;Nobe Shigeru;Kasuya Kei;Matsutani Hiroshi;Katogi Shigeki;Aoki Yu;Tahara Shingo
分类号 G03F7/00;G03F7/075;G03F7/004;G03F7/022;G03F7/023 主分类号 G03F7/00
代理机构 Griffin and Szipl PC 代理人 Griffin and Szipl PC
主权项 1. A photosensitive resin composition, comprising: (A) an alkali-soluble resin; (B) a compound which generates an acid when exposed to light; (C) a thermal crosslinking agent; (D) an acryl resin; (E) a nitrogen-containing aromatic compound represented by the following formula (1), wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.
地址 Tokyo JP