发明名称 |
Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component |
摘要 |
There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1):;
wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto. |
申请公布号 |
US9395626(B2) |
申请公布日期 |
2016.07.19 |
申请号 |
US201214364498 |
申请日期 |
2012.10.31 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
Tanimoto Akitoshi;Nobe Shigeru;Kasuya Kei;Matsutani Hiroshi;Katogi Shigeki;Aoki Yu;Tahara Shingo |
分类号 |
G03F7/00;G03F7/075;G03F7/004;G03F7/022;G03F7/023 |
主分类号 |
G03F7/00 |
代理机构 |
Griffin and Szipl PC |
代理人 |
Griffin and Szipl PC |
主权项 |
1. A photosensitive resin composition, comprising:
(A) an alkali-soluble resin; (B) a compound which generates an acid when exposed to light; (C) a thermal crosslinking agent; (D) an acryl resin; (E) a nitrogen-containing aromatic compound represented by the following formula (1), wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto. |
地址 |
Tokyo JP |